- Merk: GMB
- Productcode: TG-G1.5-01
- Levertijd: Op voorraad
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Heatsink thermal paste grease, 1.5 g weight
- Thermal compund (grease) for heatsinks
- Helps the heat dissipation from a CPU, chipset or processor to a heatsink
- Excellent thermal impedance
- Perfect stability - will not separate, run, migrate, or bleed
- Non capacitive or electrically conductive
| OPERATING ENVIROMENT | |
| Operating Temperature | -50 ~ 240 ° C |
| General | |
| Color | Grey |
| Composites | 50% silicone compounds |
| Compounds | 30% of carbon |
| Density | > 2.5 |
| Dissipation Factor | <0.005 |
| Evaporation | <0.001 % |
| The compounds of metal oxides | 20% |
| The dielectric constant | > 5.1 |
| Thermal conductivity | > 4.5 W / mK |
| Thermal Impedance | <0.205 ° C-in2 / W |
| Thixotropic index | 310 ± 10 ° C |
| Viscosity | 76 CPS |
| Volatility | <0.005 % |
| Weight | 1.5 g |
